In the first quarter of 2026, the global semiconductor and electronic components industry will usher in a rare wave of price increases across the entire industry chain in history. This is also the largest and most widely covered collective price adjustment since the industry adjustment in 2023. Starting from April 1st, the price adjustment policies of multiple international giants will officially take effect and quickly spread to the upstream and downstream of the global component supply chain. The price adjustment this time covers a wide range, almost including all core categories of electronic components, including storage chips, analog chips, MCUs (micro control units), power devices, passive components (resistors, capacitors, inductors), connectors, etc. It involves more than 50 industry-leading enterprises such as TI (Texas Instruments), Infineon, NXP, Samsung, SK Hynix, Micron, Murata, and Guoju, covering the entire industry chain of design, manufacturing, packaging, and testing.

From the perspective of industry background, since the second half of 2025, the global AI industry has entered a stage of explosive growth. The demand for AI servers, edge computing devices, high-end smart phones and other terminal products has surged, directly driving the demand for upstream electronic components to rise significantly, and some categories are in short supply. At the same time, the prices of upstream raw materials such as silicon wafers and precious metals continue to rise, coupled with the restructuring of the global supply chain and the increase in logistics costs caused by geopolitical conflicts, leading to a significant increase in production cost pressure for manufacturers and laying the groundwork for this collective price increase. In addition, some manufacturers have actively reduced their production capacity of mid to low end products and shifted towards high-end high value-added products in order to optimize their production capacity structure, further exacerbating the supply shortage of mid to low end components.

It is worth noting that this price increase is not the individual behavior of a single manufacturer, but a collaborative adjustment of the entire industry, reflecting the profound changes in the supply and demand relationship of the global electronic components industry. At present, domestic component distributors have followed up and adjusted their quotations, and some scarce categories have even experienced a "spot premium" phenomenon. Downstream end manufacturers are facing significant cost pressure, especially in cost sensitive fields such as consumer electronics and industrial control. They have begun to adjust their procurement strategies, prioritize locking in long-term supply agreements, and avoid price fluctuation risks.

Specifically, some of TI's analog chips saw the highest increase of 85%, Samsung's NAND Flash increased by over 100%, SK Hynix's LPDDR memory increased by nearly 100%, and the average increase of passive components, power devices, an other categories also reached 15% -35%. The collective price increase this time is mainly driven by three factors: firstly, the surge in demand for components brought about by the explosion of AI computing power, especially the widening gap in demand for high-end storage and analog chips; Secondly, the continuous increase in upstream raw materials and production costs has squeezed the profit margins of manufacturers; Thirdly, under the influence of geopolitics, the global supply chain is being restructured, and the production capacity of some categories is becoming increasingly tight, further pushing up prices. The industry expects that this price increase trend will continue until Q2, and prices of some scarce categories may continue to rise.