From 9 to 11 April 2026, the 14th China Information Technology Expo (CITE 2026) was officially held at the Shenzhen World Exhibition & Convention Centre. Jointly organised by the Ministry of Industry and Information Technology and the Shenzhen Municipal People’s Government, the event is one of the largest and most influential comprehensive exhibitions in China’s electronics and information technology sector. It attracted over 1,200 exhibitors from the electronic components, semiconductors, end-user devices and smart manufacturing, showcasing over 5,000 of the latest products and technologies. It attracted more than 100,000 visitors, including professional buyers, industry experts and practitioners from around the world, establishing itself as a core platform for gaining insights into trends in the electronic components industry and connecting industry chain resources.

The core theme of this year’s exhibition was ‘AI Reshaping the Hardware Supply Chain’, with AI technology serving as the central driving force across the entire industry chain and representing the event’s standout feature. From upstream electronic components and semiconductor equipment, through midstream chip design and packaging/testing, to downstream end-user devices, exhibiting companies showcased new products and technologies tailored for AI applications, demonstrating the profound transformation AI is bringing to the electronic components industry. Within the electronic components sector, the focus was on AI-compatible products, covering a wide range of categories including memory chips, power devices, passive components and connectors.

In the memory chip sector, manufacturers such as Samsung, SK Hynix and Micron showcased their latest HBM3e, DDR5 memory and high-end NAND Flash products, emphasising their high capacity, high speed and low power consumption to suit applications such as AI servers and edge computing devices; in the power device sector, manufacturers including Infineon and CR Micro displayed high-end IGBT and MOSFET products tailored for AI data centres, capable of meeting high-power and high-reliability requirements; In the passive component sector, manufacturers such as Murata and Yageo showcased high-capacity, miniaturised MLCCs and resistors, meeting the miniaturisation and lightweight requirements of AI end-user devices.

At this exhibition, the performance of domestic manufacturers was particularly impressive, with breakthroughs in areas such as domestic computing chips, AI servers and advanced packaging becoming the focal points of the event. Leading domestic chip manufacturers displayed AI chips developed in-house, with performance gradually approaching that of international counterparts whilst offering a cost advantage; Domestic electronic component manufacturers showcased high-end MLCCs and power devices, achieving import substitution in certain high-end sectors; in the advanced packaging sector, domestic manufacturers demonstrated advanced packaging technologies such as Chiplets and CoWoS, which have already achieved large-scale mass production and can meet the packaging requirements of high-end chips.

During the exhibition, numerous component manufacturers, end-user manufacturers and research institutions reached cooperation agreements, signing multiple strategic partnership agreements to further refine the AI hardware supply chain layout and promote collaborative industry development. Industry insiders noted that the hosting of CITE 2026 not only showcased the latest achievements in the electronic components sector but also established a platform for industry exchange and collaboration. With the continuous evolution of AI technology, the electronic components industry is set to embrace new development opportunities, with domestic substitution and technological innovation becoming core trends in the sector’s development.

The core theme of this exhibition was ‘AI Reshaping the Hardware Supply Chain’, with AI technology serving as the pivotal factor across the entire industrial chain. From magnetic components, power semiconductors and memory chips to domestically produced computing servers and edge computing devices, exhibiting companies showcased new products and technologies tailored to AI applications. Breakthroughs in areas such as domestically produced computing chips, AI servers and advanced packaging were particular highlights of the exhibition. The influence of domestic manufacturers within the AI hardware supply chain continues to grow, with domestic substitution and technological innovation becoming a consensus within the industry. During the exhibition, several component manufacturers entered into partnerships, further refining the layout of the AI hardware supply chain and driving collaborative development within the industry.